Copper plating is a process in which a layer of copper is electrochemically deposited onto the surface of a substrate. It is a common method used to enhance the appearance, conductivity, and corrosion resistance of various materials. Copper plating can be applied to a wide range of metals, alloys, and non-metallic surfaces Surface Preparation The substrate is thoroughly cleaned and prepared to ensure good adhesion of the copper layer. It typically involves removing any dirt, grease, or oxides from the surface through cleaning, polishing, and sometimes the use of chemical etchants.

Electrolyte Solution An electrolyte solution, known as a copper plating bath or electrolyte, is prepared. It contains copper salts, such as copper sulfate or copper pyrophosphate, dissolved in a suitable solvent. The electrolyte solution also contains other chemicals to control the plating process, such as pH adjusters, brighteners, and additives.

Electroplating The substrate is immersed in the electrolyte solution, and an electrical current is applied. The substrate acts as the cathode (negative electrode), and a copper anode (positive electrode) is also placed in the solution. As the current passes

Post-Treatment After the desired thickness of the copper layer has been achieved, the plated substrate is rinsed to remove any residual electrolyte solution. Depending on the application and desired finish, additional post-treatment steps may be performed, such as polishing, buffing, or applying a protective coating over the copper layer.